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| NP178 Series (Open Top) Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial) Specifications 1,000MW min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 30m W max. at 10mA/20mV max. Operating Temperature Range: -55C to +170C Contact Force: 30g min. per pin at minimun displacement of 0.45mm 90g max. per pin at maximum displacement of 0.8mm Part Number (Details) NP178 - 644 01 Series No. No. of Contact Pins Design Number * - ** Materials and Finish Housing: Contacts: Plating: Polyetherimide (PEI), glass-filled Beryllium Copper (BeCu) Gold over Nickel Matching IC Diameter /Socket Pin Length 1: L = 3.3 1 : AE0.350.05 2: L = 3.8 2 : AE0.450.05 MF =Flanged Unmarked = Not Flanged Outline Socket Dimensions Recommended PC Board Layout Top View from Socket NP178-64401-*-** A B C 1.27 22.860.05 1.27x36=45.720.1 1.270.05 78.000.1 26.00.05 24.00.05 3-AE1.5 +0.1 0 22.450.05 23.050.05 27.1 45.5 26.5 D 644-AE0.7 4- AE2.2 +0.1 0 1.270.05 1.27x36=45.720.1 14.30.05 +0.1 0 NP178-72002-*-** 1.270.05 AE3.0 Depth 3.0 4- AE2.2 79.000.1 52.00.1 1.270.05 23.700.05 24.300.05 +0.1 0 3-AE1.5 +0.1 0 24.5 Initial Position of Cover 1.27x38=48.260.1 1.5 AE1.45 720-AE0.7 4- AE2.2 1.27x38=48.260.1 +0.1 0 1.300.05 14.750.05 18.5 Outline IC Dimensions Pressed Down Position of Cover T 0.2 x W 0.5 L: 1 = 3.3 2 = 3.8 E G H F Part Number NP178-64401-*-** NP178-72002-*-** Test & Burn-In Grid Size 19 x 19 20 x 20 Pin Count 644 720 Socket Dimensions C D B A 78.0 79.0 74.0 1.27x36=45.72 75.0 1.27x38=48.26 67.0 69.5 E max. IC Dimensions F G H 2.54~5.9 2.54~5.9 1.27 1.27 50.0 45.72 52.8 48.26 SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER 27.750.05 28.350.05 26.50.05 27.10.05 |
Price & Availability of NP178-64401-1
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